6/18-20の日程で、中国・北京で開催されました国際ポリイミド会議「2024 International Polyimide Conference」にて４件の発表を行いました。ご招待いただきました中国科学技術院の庄永兵先生、東京工業大学の安藤慎治先生に厚く御礼申し上げます。

招待講演：

1. T. Higashihara, “N-type Naphthalene-diimide-based Semiconducting Polymer Materials Suited for Stretchable Electronics”, 2024 International Polyimide Conference, Beijing, China (On-line), p.033 (June 18-20, 2024).

口頭発表：

1. A. Momoze, T. Higashihara, N. Matsuda, Y. Maruyama, S. Fujitomi, S. Ando, R. Ishige,* “Advanced Toughness and Unique Low Thermal Expansion of Polyimide PDMS Block Copolymers and Analysis of Their Microdomain Structure”, 2024 International Polyimide Conference, Beijing, China, Oral, p.068 (June 18-20, 2024).
2. M. Matsuda, C.-Y. Lin, C.-Y. Sung, Y.-C. Lin, W.-C. Chen, T. Higashihara, “Development of Stretchable n-Type Semiconducting Polymers with Biobased Epimers as Conjugation Break Spacers”, 2024 International Polyimide Conference, Beijing, China, Oral, p.071 (June 18-20, 2024).

ポスター発表：

1. D. Miura, Y. Kawabata, T. Higashihara, “Synthesis of (Co)polyimides with High Thermal Stability, High Transparency, and Low Dielectric Constants Using an Alicyclic Fused Tetracarboxylic Anhydride Compound”, 2024 International Polyimide Conference, Beijing, China, Poster, p.095 (June 18-20, 2024).